Title:
ピンジョイント構造
Document Type and Number:
Japanese Patent JP6402223
Kind Code:
B2
Inventors:
Seichi Uchi
Application Number:
JP2017131889A
Publication Date:
October 10, 2018
Filing Date:
July 05, 2017
Export Citation:
Assignee:
Medium and Large Frozen Materials Co., Ltd.
International Classes:
F16K31/50; F16L15/00; F16L29/00
Domestic Patent References:
JP2001182898A | ||||
JP2015520339A | ||||
JP2015525719A | ||||
JP56034166U | ||||
JP61032681U | ||||
JP62037690U |
Foreign References:
GB2342416A | ||||
US2697638 | ||||
US2391022 | ||||
US20160161011 | ||||
EP2698574A1 |
Attorney, Agent or Firm:
sk patent corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito