To provide a pincette for wafer capable of picking up and taking out a wafer from a wafer carrier without contacting with a rear surface and a front surface of the wafer.

This pincette comprises a first holding member and a second holding member for holding an outer peripheral part of a wafer, and a control part for controlling an interval between the first holding member and the second holding member, and the first holding member and the second holding member have a V-grooved structure at their wafer holding parts.