Title:
配管接続構造
Document Type and Number:
Japanese Patent JP5805492
Kind Code:
B2
Abstract:
Provided is a pipe connection structure with which hermetic sealing can be improved by means of a simple structure. A width dimension (W1) and a depth dimension (d) of a first holding groove (11c) are formed to be smaller than a width dimension (W2) of a second holding groove (11e). As a result, a first O-ring (13) fitted in the first holding groove (11c) can be made to project further outwards in a state of contact with an opposing face (11d) than a second O-ring (14) made of the same material and having the same shape and size which is fitted in a second holding groove (11e). This means that the first O-ring (13) is held between the opposing face (11d) of a male-side member (11) and an edge part (12c) of a female-side member (12), and the second O-ring (14) is held between the outer peripheral part of a convex part (11b) of the male-side member (11) and a wall surface of a concave part (12b) of the female-side member, so the sealing properties can be improved by means of a simple structure.
Inventors:
Shigeru Akiike
Kenichi Suzuki
Kenichi Suzuki
Application Number:
JP2011223964A
Publication Date:
November 04, 2015
Filing Date:
October 11, 2011
Export Citation:
Assignee:
Sanden Holdings Corporation
International Classes:
F16L17/02; F16J15/10; F16L23/02
Domestic Patent References:
| JP20014251A | ||||
| JP2007107585A | ||||
| JP2008101788A | ||||
| JP2005180582A |
Foreign References:
| DE10163931A1 |
Attorney, Agent or Firm:
Ebisu International Patent Office