Title:
PLACING JOINT SURFACE FORMING SHEET AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2016084578
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve concrete quality on the periphery of a placing joint surface by securing bondability of the placing joint surface of concrete and urging or assisting discharge of moisture such as redundant water in the concrete on the periphery of the placing joint surface.SOLUTION: A placing joint surface forming sheet 1 is installed in a form 2 that forms a placing joint surface 3a of concrete 3. A large number of protrusions 12 are protruded to a front side from a flat part 1a of the placing joint surface forming sheet 1. A large number of permeable holes 1c smaller in diameter than the protrusion 12 are formed at intervals shorter than intervals among the protrusions 12, on the flat part 1a.SELECTED DRAWING: Figure 3
Inventors:
OGIBATA KUNIHITO
KAWAMURA SHIMPEI
MANAKA AKIHIRO
HOSODA YUSUKE
KAWAMURA SHIMPEI
MANAKA AKIHIRO
HOSODA YUSUKE
Application Number:
JP2014216213A
Publication Date:
May 19, 2016
Filing Date:
October 23, 2014
Export Citation:
Assignee:
FUJIMORI SANGYO
International Classes:
E04G9/10
Domestic Patent References:
| JPH01169049A | 1989-07-04 | |||
| JPH0223648U | 1990-02-16 | |||
| JPH0533484A | 1993-02-09 | |||
| JP2012012802A | 2012-01-19 | |||
| JP2000328781A | 2000-11-28 | |||
| JPS60138951U | 1985-09-13 | |||
| JPS62225660A | 1987-10-03 | |||
| JP2001009818A | 2001-01-16 |
Attorney, Agent or Firm:
Noboru Watanabe
Harada Sanjugi
Tetsumi Aono
Harada Sanjugi
Tetsumi Aono
Previous Patent: 情報通信端末、周辺機器連携方法及びプログラム
Next Patent: The amount distribution monitor method of bending and a monitoring instrument of a structure
Next Patent: The amount distribution monitor method of bending and a monitoring instrument of a structure