Title:
PLANAR MOUNTING LED ELEMENT AND FABRICATION THEREOF
Document Type and Number:
Japanese Patent JP3181262
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an LED element in which labor can be reduced at the time of fixing the LED element to a circuit board while realizing high density.
SOLUTION: An N type metal is deposited at a specified position on the surface of an N type LED basic material 1 for an N side electrode 9 and an SiO2 film is capped. A heavily doped N type alloy part reaching the base part is then formed at a part corresponding to the N side electrode part through irradiation with laser beam so that the surface side is conducted. Consequently, both P side electrode 10 and N side electrode 9 can be arranged on one side of the LED basic material 1.
Inventors:
Hideo Kondo
Hiroki Tamura
Hiroki Tamura
Application Number:
JP15597898A
Publication Date:
July 03, 2001
Filing Date:
June 04, 1998
Export Citation:
Assignee:
Stanley Electric Co., Ltd.
International Classes:
H01L27/15; H01L33/02; H01L33/36; H01L33/62; (IPC1-7): H01L33/00
Domestic Patent References:
| JP669540A | ||||
| JP62172756A | ||||
| JP59121924A |
Attorney, Agent or Firm:
Teruo Akimoto