Title:
プレーナ熱アレイ
Document Type and Number:
Japanese Patent JP2007511747
Kind Code:
A
Abstract:
A thermal sensor structure having one level for an infrared detecting pixel including the sensor associated electronics. The electronics displace a small area thereby having little effect on the fill area of the pixel relative to a level having no pixel electronics. That level has thermally isolation for the substrate through the limited structural attachment to the substrate because of the access vias to the silicon. It has additional isolation because of a pit of removed silicon from the substrate below that one level. The thermal sensor may have an array with a large number of pixels having the one level for the pixels and electronics structure.
Inventors:
Wood, Roland A
Cowl, Barrett Yee
Robert Ree, Hioashi
Cowl, Barrett Yee
Robert Ree, Hioashi
Application Number:
JP2006534229A
Publication Date:
May 10, 2007
Filing Date:
October 01, 2004
Export Citation:
Assignee:
Honeywell International Inc.
International Classes:
G01J1/02; G01J5/20; H01L27/14; H01L27/146; H01L31/0248; H01L31/09; H01L37/00
Domestic Patent References:
| JPS63310165A | 1988-12-19 | |||
| JP2002057312A | 2002-02-22 | |||
| JP2003110938A | 2003-04-11 | |||
| JPH03287022A | 1991-12-17 | |||
| JP2001281051A | 2001-10-10 | |||
| JP2000146686A | 2000-05-26 | |||
| JPH033268A | 1991-01-09 |
Attorney, Agent or Firm:
Kazuo Shamoto
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Yoshio Akimoto
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Yoshio Akimoto