Title:
PLANARIZING PROCESSOR AND PLANARIZING PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2023159571
Kind Code:
A
Abstract:
To provide a planarizing processor capable of obtaining a workpiece having an excellent flatness level.SOLUTION: A planarizing processor (200) comprises: a local plasma source (10) that excites a process gas into plasma and supplies it locally to the front surface of a workpiece (60); a sample stage (8) on which the workpiece is mounted; a movement mechanism (9) that changes a relative position of the local plasma source and the sample stage; and a control device (20). The control device includes: a movement control part (38); a region setting part (33); a reference speed calculation part (34); a proportion calculation part (35); a correction speed calculation part (36); and a speed distribution calculation part (37). The movement control part scans and moves the supply position in accordance with the distribution.SELECTED DRAWING: Figure 7
Inventors:
IWASE CHIKATSU
KANO RYO
KANO RYO
Application Number:
JP2022069332A
Publication Date:
November 01, 2023
Filing Date:
April 20, 2022
Export Citation:
Assignee:
SANYU SEISAKUSHO KK
International Classes:
H01L21/3065
Domestic Patent References:
| JP2003318156A | 2003-11-07 | |||
| JP2007149923A | 2007-06-14 | |||
| JP2009253234A | 2009-10-29 | |||
| JP2009246008A | 2009-10-22 | |||
| JP2009224517A | 2009-10-01 | |||
| JP2020170756A | 2020-10-15 | |||
| JP2022012769A | 2022-01-17 |
Attorney, Agent or Firm:
Yoshinobu Kanayama
Shohei Sakai
Shohei Sakai
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