Title:
PLANE BALUN BUILT IN PRINTED BOARD AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2006135056
Kind Code:
A
Abstract:
To provide a plane balun built in a printed board wherein a board can be easily assembled without multilayering and degrading performance.
A transmission line (1) for balance signal and a transmission line (2) for unbalance signal are formed on the same plane so that their side faces are opposite to each other, and a dielectric (3) is interposed between the transmission lines (1) and (2) and between the transmission lines and a ground potential layer (4) nearly parallel to the transmission lines at a prescribed space.
Inventors:
WATANABE SHOJI
HIGUCHI TSUTOMU
HIGUCHI TSUTOMU
Application Number:
JP2004322000A
Publication Date:
May 25, 2006
Filing Date:
November 05, 2004
Export Citation:
Assignee:
SHINKO ELECTRIC IND CO
International Classes:
H05K1/02; H01F19/06
Attorney, Agent or Firm:
Atsushi Aoki
Jun Tsuruta
Tetsuro Shimada
Masaya Nishiyama
Higuchi Souji
Jun Tsuruta
Tetsuro Shimada
Masaya Nishiyama
Higuchi Souji