Title:
PLANE GRINDING METHOD OF DIAMOND COMPACT, AND CONVEYING CRIMP EQUIPMENT
Document Type and Number:
Japanese Patent JP2002205249
Kind Code:
A
Abstract:
To provide a diamond compact crimp body having surface flatness of 2.0 μm or shorter.
A jig 30 is fixed to a chuck 6 on a moving table 4 of a grinding device 1, conveying crimp equipment is inserted and fixed into a recessed part in the jig so that a surface of a disk-like diamond compact 50d is turned up, a vitrified bond diamond wheel 3 rotating at 2000 to 4000 min-1 is pressed onto the disk-like diamond compact surface, and a table is inverted at a distance moving width D of 1.5 to 5 times diameter of the diamond compact and at a high inverting speed of 200 to 500 stroke/min, thereby grinding the plane of the diamond compact.
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Inventors:
MISAWA TAKASHI
KUBO TOMIO
KUBO TOMIO
Application Number:
JP2001002013A
Publication Date:
July 23, 2002
Filing Date:
January 10, 2001
Export Citation:
Assignee:
OKAMOTO MACHINE TOOL WORKS
International Classes:
B24B7/22; (IPC1-7): B24B7/22
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