PURPOSE: To obtain a high density dual in-line type electronic part which can support plane packaging, which is easy to pitch a micro-terminal and whose package width is 3mm or less by providing outer lead parts arranged on one of end faces of an element substrate.
CONSTITUTION: An electronic part mentioned in the title comprises an element substrate 6 wherein a plurality of conductors and a plurality of passive element 4 are arranged on at least one of surfaces of an insulation substrate or inside it while a plurality of terminal connecting conductors 2, 2' are provided so that they are connected to the respective conductors and the passive elements 4 in the vicinity of one of the end faces of the insulation substrate as well as plurality of end face conductors 5 for connecting between the conductors on both surface and rear face are provided on the other end face, a plurality of pairs of lead terminals 7 which are soldered to be connected to the terminal connecting conductors 2, 2' respectively and sealing resin 8 for sealing the element substrate 6 with a part of the lead terminals 7. In this part, the respective lead terminals 7 pass through the sealing resin 8 to further protrude out of the sealing resin 8 and are bent along the side or the bottom of the sealing resin 8, and provided with outer lead parts 7" arranged on one of the end faces of the element substrate 6.
NISHIDA KOJI
YAMASHITA SHOZO
TAKADA KINJI
