To provide a plasma melting decomposition treatment method for a PCB-containing busing which can be treated in a plasma melting decomposition furnace.
The plasma melting decomposition treatment method for the PCB-containing bushing includes the cutting process in which the PCB-containing bushing is cut perpendicularly to the longitudinal direction into a plurality of parts to obtain cutting products, the crushing process in which the cutting products are crushed to obtain crushing products, the mixing process in which the crushing products and a basicity conditioning agent which melts in a plasma decomposition apparatus and reacts with the alumina of the crushing products to produce a compound having a melting point lower than that of alumina are put in a drum can and agitated/mixed to obtain a mixture, the process in which the mixture is enclosed in a drum can, and the process in which the drum can with the mixture enclosed is charged into the plasma decomposition apparatus to melt the mixture by plasma decomposition.
COPYRIGHT: (C)2009,JPO&INPIT
Toru Kinukawa
Takashi Kuchiuchi
Tagashi Shigeno
Yoshiaki Shimizu
Koji Kajiwara
Shinko Environmental Solution Co., Ltd.
| JP2002503328A | ||||
| JP2006297233A | ||||
| JP771733A | ||||
| JP2005262196A |
| WO2005093323A1 |
Takato Tsutsumi