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Title:
PLASMA PROCESSING APPARATUS AND METHOD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2015111544
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a plasma processing apparatus and method capable of achieving uniform plasma processing with good reproductivity, and to provide a method of manufacturing an electronic device.SOLUTION: A base material holder 12 moves on a transportation roller 13. At a timing when a temperature measurement sample 14 is irradiated with a high-temperature plasma by an inductively-coupled plasma torch unit T, a temperature measurement unit 15 measures a temperature of the sample 14. A high-frequency power of the inductively-coupled plasma torch unit T is quickly controlled on the basis of the measurement value measured by the temperature measurement unit 15, and thereby, plasma processing with excellent reproductivity can be achieved.

Inventors:
OKUMURA TOMOHIRO
HARAGUCHI HIDEO
Application Number:
JP2014098349A
Publication Date:
June 18, 2015
Filing Date:
May 12, 2014
Export Citation:
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Assignee:
PANASONIC IP MAN CORP
International Classes:
H05H1/30; C23C16/458; C23C16/505; C23C16/52; H01L21/20; H01L21/205; H01L21/265; H01L21/3065; H01L21/324; H05H1/24
Domestic Patent References:
JP2012054132A2012-03-15
JP2007287452A2007-11-01
JP2010020903A2010-01-28
JPH05275376A1993-10-22
JP2001077034A2001-03-23
JP2012054132A2012-03-15
JP2007287452A2007-11-01
JP2010020903A2010-01-28
JPH05275376A1993-10-22
JP2001077034A2001-03-23
Attorney, Agent or Firm:
Kentaro Fujii
Kenji Kamada
Hiroo Maeda



 
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