PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

Title:

PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

Document Type and Number:

Japanese Patent JP2004172364

Kind Code:

A

Abstract:

To provide a plasma processing apparatus and a method, which carries out a plasma dicing process and a mask and micro crack removing process successively by the use of the same apparatus.

The plasma processing apparatus is equipped with a pressure controlling means controlling the inner pressure of a processing chamber 2, plasma generating gas feeders 21, 22, and 23, which selectively feed various kinds of plasma generating gases into the processing chamber 2, and an inter-electrode distance changing means which changes a distance between electrodes. Plasma processing conditions including the kinds of gases, pressure, and an inter-electrode distance are switched corresponding to the object of processing so as to carry out a plasma dicing process, a mask removing process, and a micro crack removing process effectively in succession.

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Inventors:

ARITA KIYOSHI

Application Number:

JP2002336415A

Publication Date:

June 17, 2004

Filing Date:

November 20, 2002

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD

International Classes:

H01L21/304; H01L21/301; H01L21/78; (IPC1-7): H01L21/301; H01L21/304

Attorney, Agent or Firm:

Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito

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