Title:
PLASMA PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2004128366
Kind Code:
A
Abstract:
To provide a plasma processing apparatus for making work in an electrical discharge chamber easy and for making it possible to process uniformly matter to be processed.
In the plasma processing apparatus, a hermetically sealed plasma processing space is formed by using a base platform 21 and a cover member 22. The cover member 22 can contact and separate from the base platform 21. A gas supply port 24 is provided in a side of the cover member 22 and a gas exhaust port 25 in a side of the base platform 21. Thereby, gases flow uniformly on a surface of the matter to be processed, allowing more uniform plasma surface processing.
Inventors:
TERAI HIROKAZU
HONJO ICHIHIRO
NISHIHARA YASUHIRO
HONJO ICHIHIRO
NISHIHARA YASUHIRO
Application Number:
JP2002293190A
Publication Date:
April 22, 2004
Filing Date:
October 07, 2002
Export Citation:
Assignee:
SAMCO INTERNAT INC
International Classes:
C23C16/50; H01L21/205; H01L21/3065; (IPC1-7): H01L21/3065; C23C16/50; H01L21/205
Attorney, Agent or Firm:
Ryouhei Kobayashi
Naotsune Takeuchi
Naotsune Takeuchi