Title:
PLASMA PROCESSING DEVICE
Document Type and Number:
Japanese Patent JPS5681929
Kind Code:
A
Abstract:
PURPOSE:To perform processing and machining to the whole surface by holding the underside peripheral edge of a sample by means of a slant plane of a supporting projection part alone. CONSTITUTION:A supporting plane 13 of a projection part 7 of a hole 5 installed at the upper electrode plate of a plasma device to hold a wafer 6 is inclined and the inclined angle is equal to the angle of a chamfering part 14 of the wafer. Accordingly, the wafer is positioned in the center of a hole and the maching of the whole area of the underside of the wafer required to be processed and machined can be performed.
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Inventors:
YOKOYAMA HIROSHI
NAGATOMO HIROTO
AKIBA MASAKUNI
NAGATOMO HIROTO
AKIBA MASAKUNI
Application Number:
JP15912279A
Publication Date:
July 04, 1981
Filing Date:
December 10, 1979
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/205; C23C16/458; H01L21/302; H01L21/3065; H01L21/31; (IPC1-7): H01L21/205; H01L21/302