Title:
プラズマ処理装置およびその制御方法
Document Type and Number:
Japanese Patent JP4846190
Kind Code:
B2
Abstract:
In a plasma processing apparatus for processing an object to be processed by generating plasma in a processing chamber: a first electrode is arranged in the processing chamber and a second electrode is arranged to face the first electrode in the processing chamber; a first and a second power systems include a first and a second power supplies for supplying a first and a second powers to the first and the second electrodes, respectively; and a control unit controls both or either one of the first and the second power systems so as to apply a preprocessing voltage to the second electrode for a time period before plasma processing is performed on the object.
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Inventors:
Koshiishi
Kitano Masatoshi
Kitano Masatoshi
Application Number:
JP2003138274A
Publication Date:
December 28, 2011
Filing Date:
May 16, 2003
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065; B01J19/08; B01J19/12; C23F4/00; H01J37/32; H01L21/00; H01L21/205; H05H1/46
Domestic Patent References:
| JP60213026A | ||||
| JP2001230239A | ||||
| JP2002043235A | ||||
| JP2003007674A |
Attorney, Agent or Firm:
Miaki Kametani