Title:
プラズマ処理装置
Document Type and Number:
Japanese Patent JP6991934
Kind Code:
B2
Abstract:
To provide a plasma processing apparatus that can suppress CD variation by controlling the plasma density distribution.SOLUTION: In a plasma processing apparatus, plasma generation means includes a plurality of microwave sources 101 and 201 that oscillates microwaves, a circular waveguide 104 to which one microwave source 101 is connected, an excitation line 205 connected to the other microwave source 201, and a cylindrical cavity resonator 106 to which the circular waveguide 104 and the excitation line 205 are connected, and the distribution of the low-order mode electric field and the high-order mode electric field formed in a vacuum processing chamber 110 connected to the cavity resonator 106 via a microwave introduction window 107 can be adjusted.SELECTED DRAWING: Figure 2
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Inventors:
Motohiro Tanaka
Application Number:
JP2018125746A
Publication Date:
January 13, 2022
Filing Date:
July 02, 2018
Export Citation:
Assignee:
Hitachi High-Tech Co., Ltd.
International Classes:
H05H1/46; H01L21/3065
Domestic Patent References:
| JP2012212921A | ||||
| JP2005235755A | ||||
| JP2017055035A | ||||
| JP3140470A | ||||
| JP2017521556A |
Attorney, Agent or Firm:
Patent Business Corporation Daiichi International Patent Office
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