To provide a plasma processor for preventing electrostatic damage on a pattern on a substrate by safely transferring the substrate after plasma processing to a load locking chamber, without generating the local potential difference on the substrate, and to provide a substrate transfer method.
The plasma processor has a processing chamber 1 which generates a plasma, while the chamber is maintained vacuum of prescribed pressure and plasma-processes the surface of the substrate 8 loaded on a substrate electrode 7, and a transfer chamber 13 and the load locking room 14 for carrying in the processed substrate and carrying it out. When the substrate is transported from the processing chamber 1 to the load locking room 14 through the transfer room 13 and the substrate 8 is put on the substrate stand 15A of the load locking chamber 14, the substrate contact parts of all members which are brought into contact with the substrate 8 are formed of insulators.
TAKEDA HIDENORI
YAMAGUCHI NAOSHI
SEKIGUCHI HIROYOSHI
