PURPOSE: To provide a plasma processor with a mounting base structure that causes no damage to an electrostatic chuck when the mounting base having the electrostatic chuck is adjusted at a specific cooling temperature.
CONSTITUTION: Within the plasma processor wherein an electrostatic chuck 8 holding a work 12 by electrostatic suction is junctioned on an electrostatic block 13, a mounting base 9 provided with a cooling mechanism is arranged in a vacuum vessel to plasma-process the work 12 using plasma produced in the vacuum vessel, the electrode block 13 is composed of a material in the thermal expansion coefficient having a little difference from that of the electrostatic chuck 8. In such a constitution, simultaneously with the acceleration of the thermal conduction by junctioning the electrostatic chuck 8 with the electrode block 13, the stress due to the difference in the thermal expansion coefficient imposed on said junction surface in the low temperature cooling time can be suppressed. Through these procedures, since no damage is caused to the junction surface due to the stress imposition even in the low temperature cooling time, the mounting base 9 can be controlled at specific cooling temperature thereby enabling the plasma processing such as etching step, etc., to be performed with high precision.
KINOSHITA TAKASHI
NISHIZUKA TETSUYA
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