To improve the uniformity of the film thickness in a substrate, as to a holder in a vacuum vessel holding the substrate to be surface-treated by providing the circumferential part of the substrate with blow-off ports for plasma generating gas.
A rotary holder 8 holding a substrate 5 and capable of rotation is provided, also, preferably, the circumferential part of the substrate 5 is uniformly deposited with plural blow-off ports 11a, 11b, 11c and 11d for plasma generating gas, and the circumference of the substrate 5 fitted to the rotary holder 8 drived by a motor 9 is provided with blow-off ports 11a, 11b, 11c and 11d. The surface of the axial center of a base edge part 12 extensionally provided on the outer part of a vacuum vessel 1 and fitted with a gear 10 is provided with a gas introducing port 13. Plasma generating gas introduced from the gas introducing port 13 is jetted from the blow-off ports 11a, 11b, 11c and 11d uniformly arranged on the circumferential part of the substrate 5 to the inside of the vacuum vessel 1. The sputtering device improves the uniformity of the film thickness in the substrate face.
MORI TATSUYUKI
YOKOYAMA MASAHIDE
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