Title:
Plasma treatment apparatus
Document Type and Number:
Japanese Patent JP6277015
Kind Code:
B2
Abstract:
A plasma processing apparatus, comprising a processing chamber within a vacuum chamber, and a sample stage arranged within the processing chamber with a sample to be processed placed on its top surface, wherein plasma is formed in the processing chamber to perform processing of the sample, wherein the sample stage is provided with an electrostatic chuck which is provided with film electrodes to which power for attraction of the sample is supplied, and upper and lower plate-like sintered bodies joined mutually with the electrodes interposed between them from above and below, and the lower sintered body has a dielectric constant higher than that of the upper sintered body.
Inventors:
Takumi Tanto
Kohei Sato
Yuichi Kawasaki
Akitaka Makino
Kohei Sato
Yuichi Kawasaki
Akitaka Makino
Application Number:
JP2014037691A
Publication Date:
February 07, 2018
Filing Date:
February 28, 2014
Export Citation:
Assignee:
Hitachi High-Technologies Corporation
International Classes:
H01L21/3065; C23C16/458; C23C16/50; H01L21/265; H01L21/683
Domestic Patent References:
| JP2012222233A | ||||
| JP7130826A | ||||
| JP2022166A | ||||
| JP2009235536A | ||||
| JP5299494A | ||||
| JP4367247A |
Attorney, Agent or Firm:
Shigemi Iwasaki