Title:
PLASMA TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP3916469
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a plasma treatment device in which sticking to a counter electrode is reduced.
SOLUTION: A counter electrode 60 facing a holding electrode for holding a substrate to be treated while sandwiching a plasma treatment space in a vacuum chamber is configured by overlapping metal members 60 and 62 of an electric conductor, a metal member 63 of a different coefficient of thermal expansion, and a non-metal member 64. A gap between the metal member 63 and the non-metal member 64 is filled with adhesives or the like. The metal member 63 is impressed with high frequency power. Thus, the influence of the difference in the coefficients of thermal expansion is relaxed, the temperature elevation of the non-metal member is suppressed as well, and a bias voltage is efficiently loaded to the non-metal member.
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Inventors:
Hiroshi Okumura
Masahito Tashiro
Nohisa Hirano
Kamozaka Mitsunobu
Yasuhiro Tobe
Masahito Tashiro
Nohisa Hirano
Kamozaka Mitsunobu
Yasuhiro Tobe
Application Number:
JP2002005981A
Publication Date:
May 16, 2007
Filing Date:
January 15, 2002
Export Citation:
Assignee:
FO Corporation
International Classes:
H01L21/3065; H05H1/46; C23C16/509; H01L21/205; H01L21/302; (IPC1-7): H01L21/3065; C23C16/509; H01L21/205; H05H1/46
Domestic Patent References:
| JP9067685A | ||||
| JP7335635A | ||||
| JP10144663A | ||||
| JP11149995A |
Attorney, Agent or Firm:
Naoki Kubota
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