Title:
プラスチック導電性微粒子及びその製造方法
Document Type and Number:
Japanese Patent JP2008525642
Kind Code:
A
Abstract:
Plastic conductive particles having an outer diameter of 2.5 mum~1 mm obtained by sequentially plating a 0.1~10 mum thick metal plating layer and a 1~100 mum thick Pb solder layer or a Pb-free solder layer on plastic core beads having a high elastic modulus of compression, and a method of manufacturing thereof. The method of manufacturing the plastic conductive particles includes preparing plastic core beads having excellent thermal properties and a high elastic modulus of compression, etching surfaces of the plastic core beads for surface treatment thereof, forming a metal plating layer via electroless plating to improve adhesion between the bead surface and the metal plating layer, and then forming a solder layer such that a sealed hexagonal barrel is immersed in an electroplating solution and then an electroplating process is conducted using a mesh barrel rotating 360° at 6~10 rpm or a mesh barrel having a structure in which one surface of a conventional sealed hexagonal barrel is open, and rotating 200° in right and left directions at 1~5 rpm, to manufacture plastic conductive particles having a size of 1 mm or less. The plastic conductive particles of this invention enable the maintenance of packaging gaps, and thus can be applied to IC packaging, LCD packaging and other conductive materials.
Inventors:
Min Byung-hun
Kim, Kyung Hum
Kim, Sung Bum
Lee Sung Soo
Park
Kim, Nam Gyul
Yoo Byung Jae
Kim, Kyung Hum
Kim, Sung Bum
Lee Sung Soo
Park
Kim, Nam Gyul
Yoo Byung Jae
Application Number:
JP2007549257A
Publication Date:
July 17, 2008
Filing Date:
December 28, 2005
Export Citation:
Assignee:
Dombu High-Tech Company Limited
International Classes:
C25D7/00; B23K35/14; B23K35/26; B23K35/40; C22C13/00; C22C13/02; C23C18/52; C25D5/12; C25D5/56; C25D17/16; H01B5/00; H01B13/00
Domestic Patent References:
| JP98046811A | ||||
| JPH0213205A | 1990-01-17 |
Attorney, Agent or Firm:
Kenzo Hara International Patent Office