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Patent Searching and Data


Title:
PLASTIC FILM DEPOSITION SYSTEM
Document Type and Number:
Japanese Patent JP2005240081
Kind Code:
A
Abstract:

To provide a plastic film deposition system for production of an adhesion evaluation sample with which the adhesion strength of a two-layered flexible substrate can be rapidly measured with good accuracy.

The plastic film deposition system has a plurality of deposition chambers 3 for forming an underlying metallic layer on a plastic film by a dry plating method, then in succession, forming a metallic layer on the underlying metallic layer by a dry plating method in vacuum. The deposition system is equipped with the second deposition chamber 4 for forming the underlying metallic layer on the plastic film in the first deposition chamber 3 out of the above deposition chambers, then forming the pattern for measuring the adhesion strength of the plastic film formed with the underlying metallic layer and a conveyance section 2 for conveying the substrate to the ensuing process for generation of the flexible substrate.


Inventors:
SAEKI HIROSHI
Application Number:
JP2004049659A
Publication Date:
September 08, 2005
Filing Date:
February 25, 2004
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
C23C14/14; H05K3/00; H05K3/14; (IPC1-7): C23C14/14; H05K3/00; H05K3/14
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito