Title:
PLASTIC MOLDING COMPOUND
Document Type and Number:
Japanese Patent JPS6094445
Kind Code:
A
Abstract:
The invention concerns a thermoplastic moulding compound based on a rubber-modified copolymer consisting of styrene and/or alpha -methylstyrene and maleic anhydride, characterized in that the moulding compound consists of a mixture of
A. 50-95 % (wt) of a copolymer consisting of:
1. 50-95 % (wt) styrene and/or alpha -methylstyrene
2. 50-5 % (wt) maleic anhydride
3. 0-20 % (wt) acrylate
4. 0-20 % (wt) acrylonitrile
B. 5-50 % (wt) of an ethylene-propylene rubber or ethylene-propylene-diene rubber modified by grafting with a compound containing hydroxyl, amide or amine.
C. 0-30 % (wt) ethylene-propylene rubber or ethylene-propylene-diene rubber.
The compounds have in addition to a good UV resistance an excellent impact resistance and dimensional stability under heat and rigidity.
Inventors:
HERUMAN AUGUSUCHINUSU YOHANESU
UIRUHERUMUSU ANTONIUSU MARII D
UIRUHERUMUSU ANTONIUSU MARII D
Application Number:
JP20419284A
Publication Date:
May 27, 1985
Filing Date:
October 01, 1984
Export Citation:
Assignee:
STAMICARBON
International Classes:
C08L7/00; C08L21/00; C08L23/00; C08L25/12; C08L25/16; C08L33/00; C08L33/02; C08L35/00; C08L35/06; C08L51/00; C08L51/02; C08L51/04; C08L101/00; C08L51/06; (IPC1-7): C08L35/06; C08L51/04
Domestic Patent References:
| JPS5765745A | 1982-04-21 |
Foreign References:
| DE3140565A1 | 1983-04-21 |
Attorney, Agent or Firm:
Toshio Yano (1 outside)