Title:
樹脂封止パッケージ
Document Type and Number:
Japanese Patent JP5551516
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin sealed package which has a chip window and prevents the reduction of the package strength despite the small, thin, and simple structure.SOLUTION: In the resin sealed package, a chip 307, which is to be sealed in an aperture 311 located in a center part of an insulative substrate opening 312 of a recessed insulative substrate 301 which opens at the center, is arranged, and an underside of the chip 307 is exposed to a package surface. A stepped portion is provided inside the insulative substrate, and a first electrode 303 is arranged in the stepped portion. The first electrode 303 is electrically connected to a chip 307 with bonding wire 305 and is also connected to a second electrode 304 serving as an external connection terminal of the resin sealed package via internal wirings 302 and 306.
Inventors:
徳尾 Seiichi
Application Number:
JP2010118629A
Publication Date:
July 16, 2014
Filing Date:
May 24, 2010
Export Citation:
Assignee:
Asahi Chemical electronics incorporated company
International Classes:
H01L23/08; H01L23/02; H01L31/02; H01L33/48
Attorney, Agent or Firm:
Patent business corporation A valley and Abe patent firm