Title:
樹脂封止型半導体装置
Document Type and Number:
Japanese Patent JP4325531
Kind Code:
B2
Inventors:
Kusunoki Junya
Takashi Hirano
Takashi Hirano
Application Number:
JP2004301613A
Publication Date:
September 02, 2009
Filing Date:
October 15, 2004
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
H01L25/065; C08F32/00; C08G61/06; H01L21/52; H01L25/07; H01L25/18
Domestic Patent References:
| JP2001168113A | ||||
| JP2006114757A | ||||
| JP62027412A | ||||
| JP8259784A | ||||
| JP11124553A | ||||
| JP2002296780A | ||||
| JP2005519150A | ||||
| JP2005532678A | ||||
| JP2006096873A | ||||
| JP2006022195A | ||||
| JP2006063119A | ||||
| JP2004099833A | ||||
| JP2003020325A |
Foreign References:
| WO2003072673A1 | ||||
| WO2003107427A1 |
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