To provide a semiconductor device, with which a step or the like of applying an adhesive leading to a drawback in workability during production of an MCP in a stacked structure is improved, a semiconductor chip can be laminated without the use of the adhesive, and the reliability of various aspects are superior.
A resin-encapsulated semiconductor device of the MCP in a stacked structure has a resin layer 3 of a photosensitive resin composition, containing a cyclic olefin-based resin (A) having an epoxy group and a photoacid generator (B) on a circuit-element forming surface of the semiconductor chip 2, wherein the back surface of another semiconductor chip 6 laminated on the semiconductor chip is in direct contact with the resin layer.
COPYRIGHT: (C)2010,JPO&INPIT
Hiroaki Makabe
Yasunori Takahashi
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