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Title:
PLATE-LIKE BODY COOLING DEVICE AND HEAT TREATING SYSTEM
Document Type and Number:
Japanese Patent JP2009019832
Kind Code:
A
Abstract:

To provide a plate-like body cooling device capable of cooling a heat-treated plate-like body and efficiently cooling while reducing the size of the device.

The plate-like body cooling device 1 includes a plate-like body placing part on which the plate-like body 90 is arranged, and a cooling member 10. The cooling member 10 is provided with a blowout member 20 and a suction member 30, and the blowout member 20 and the suction member 30 are arranged to oppose each other with the plate-like body 90 sandwiched in between. Further, in the plate-like body placing part 11, an opening part 11a is arranged capable of conveying the plate-like body 90 out. The opposing direction of the blowout member 20 and the suction member 30 is the direction crossing the direction of conveying the plate-like body 90 out on an open face of the plate-like body placing part 11.


Inventors:
KANDA TOSHIRO
Application Number:
JP2007183521A
Publication Date:
January 29, 2009
Filing Date:
July 12, 2007
Export Citation:
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Assignee:
ESPEC CORP
International Classes:
F27B9/12; F27D3/12; F27D9/00; F27D19/00; H01L21/027
Domestic Patent References:
JP2004085157A2004-03-18
JP2002071936A2002-03-12
JP2007147832A2007-06-14
Attorney, Agent or Firm:
Takashi Fujita



 
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