Title:
PLATE MATERIAL PROCESSING DEVICE AND PLATE MATERIAL PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2020029004
Kind Code:
A
Abstract:
To provide a plate material processing device capable of subdividing an edge part of a to-be-cut plate material.SOLUTION: A plate material processing device comprises: a pair of first cutters; a pair of first drive parts which relatively moves the first cutter and a plate material to cut an edge part of the plate material by the pair of first cutters; a pair of second cutters; a pair of second drive parts which reciprocates the pair of second cutters in a width direction of the plate material orthogonal to the relative movement direction of the plate material to make a cut in the middle of the edge part of the plate material by the pair of second cutters; and a pair of third drive parts which moves the pair of second cutters in the relative movement direction of the plate material when the cut is made in the middle of the edge part of the plate material by pair of the second cutters.SELECTED DRAWING: Figure 1
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Inventors:
INOUE TOSHIO
Application Number:
JP2018154573A
Publication Date:
February 27, 2020
Filing Date:
August 21, 2018
Export Citation:
Assignee:
OTSUBO TEKKOSHO CO LTD
International Classes:
B27B5/04; B23D45/02; B23D45/10; B23D47/08; B26D1/14; B26D1/15; B26D1/18; B26D1/60; B27B5/02; B27B5/18
Attorney, Agent or Firm:
Yosuke Koreeda
Hiroyuki Kusuniya
Hiroyuki Kusuniya