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Title:
PLATE FOR MOLDING LAMINATED SHEET AND LAMINATED SHEET
Document Type and Number:
Japanese Patent JP2000158582
Kind Code:
A
Abstract:

To provide a plate for molding a laminated sheet capable of omitting the labor in the use or control of a patterning film.

A prepreg and a metal foil are superposed one upon another to form a combined material. In a plate for molding a laminated sheet used when the combined material is molded under pressure while current is passed through the metal foil to generate heat, an electric insulating layer 3 is formed on the surface of an aluminum layer 2 and the coefficient of thermal expansion is set to 9-18 ppm. By forming the laminated sheet by using the plate when the combined material is molded under pressure while current is passed through the metal foil to generate heat, the dimensional behavior of the laminated sheet can be made same to that of the plate for molding the laminated sheet made of stainless steel.


Inventors:
ICHIKI TSUTOMU
MISAWA HIDETO
Application Number:
JP33390598A
Publication Date:
June 13, 2000
Filing Date:
November 25, 1998
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B32B15/08; B29C43/18; B29C43/32; B29K105/06; (IPC1-7): B32B15/08; B29C43/18; B29C43/32
Attorney, Agent or Firm:
Keisei Nishikawa (1 person outside)