Title:
板状体切断方法並びにレーザ加工装置
Document Type and Number:
Japanese Patent JP4838531
Kind Code:
B2
Abstract:
To provide a method for cutting a plate-shaped body, such as a semiconductor wafer, by irradiating the body with a laser beam, in which the throughput of electronic parts manufactured by dividing the body is improved by raising the cutting speed. The laser beam of a first wave length having absorbability with respect to a plate-shaped body 1, and the laser beam of a second wave length having permeability with respect to the plate-shaped body 1, are simultaneously condensed, and the condensed beams are irradiated to the plate-shaped body 1. A condensing point 7 of the laser beam of the first wave length is formed on the surface part of the plate-shaped body, and a condensing point 8 of the laser beam of the second wave length is formed in the inside part of the plate-shaped body, by controlling a condensing optical system. Cracking or reforming of the composition of the surface part is caused by linear absorption, reforming of the composition of the inside part is caused by multiphoton absorption, and stress-generating regions are formed in the parts respectively. The plate-shaped body 1 is irradiated with the laser beam along a dividing line, and is thereafter divided along the scanning loci of the laser beam by exerting mechanical impact force.
Inventors:
Sumiyoshi Tetsumi
Imaho Tomohiro
Imaho Tomohiro
Application Number:
JP2005129396A
Publication Date:
December 14, 2011
Filing Date:
April 27, 2005
Export Citation:
Assignee:
CyberLaser Co., Ltd.
International Classes:
B23K26/40; B23K26/067; B23K26/38; B23K101/40; H01L21/301
Domestic Patent References:
| JP2004160483A | ||||
| JP2001293589A | ||||
| JP2002324768A | ||||
| JP2004351466A | ||||
| JP2003211400A | ||||
| JP2005096459A | ||||
| JP2005088068A | ||||
| JP2005100599A | ||||
| JP2005077606A | ||||
| JP2005007427A | ||||
| JP2003290961A |
Attorney, Agent or Firm:
Sonoda Yoshitaka
Kobayashi Yoshinori
Kobayashi Yoshinori