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Title:
PLATED ALUMINUM ELECTRIC WIRE, INSULATING PLATED ALUMINUM ELECTRIC WIRE AND THEIR PRODUCTION
Document Type and Number:
Japanese Patent JPH10237674
Kind Code:
A
Abstract:

To enable the production of a lightweight plated aluminum electric wire by successively applying an anchor metallic layer by substitution plating and a highly conductive metallic layer by electroplating on the outer circumference of an aluminum material conductor.

On the outer circumference of an aluminum conductor 1 (about 0.5mm), an anchor metallic layer 2 (having about 1μm thickness) is formed by substitution plating. Next, on the anchor metallic layer 2, a strike plating layer 3a (having about 2μm thickness) and a thick plating layer 3b (having about 7μm thickness) are successively formed by electroplating, and a highly conductive metallic layer 3 is applied to produce a plated aluminum electric wire 10. Moreover, as the anchor metallic layer 2, zinc, nickel, copper, gold, silver or alloys consisting essentially of them is used, and as the highly conductive metallic layer 3, copper, gold, silver, nickel, solder or alloys consisting essentially of them is used. Furthermore, the cross-sectional area ratio of the aluminum conductor 1 to the plated aluminum electric wire 10 is regulated to ≥85%.


Inventors:
KITAZAWA HIROSHI
YAMAGUCHI TATSUO
Application Number:
JP5409597A
Publication Date:
September 08, 1998
Filing Date:
February 20, 1997
Export Citation:
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Assignee:
TOTOKU ELECTRIC
International Classes:
C23C18/16; C23C28/02; C25D7/06; H01B1/02; (IPC1-7): C23C28/02; C23C18/16; C25D7/06; H01B1/02