To provide a plated article having a metal-plated film whose thickness is made thick by an electroless plating method without combining an electroplating method and which is prevented from being swollen or peeled off in an electroless plating bath even when the thickness of the metal-plated film is made thicker than conventional one.
This invention relates to the plated article comprising: a base material 1; a coated film layer 2 which is provided on the surface of the base material 1 and contains at least conductive polymer fine particles and a binder; and a metal-plated film 3 formed on the coated film layer 2 by the electroless plating method, wherein the metal-plated film has a thickness of ≥2.0 μm when the metal-plated film is made of copper, the metal-plated film has a thickness of ≥0.2 μm when the metal-plated film is made of nickel, the coated film layer has a surface roughness Ra of 0.05 to 2.0 μm, and the binder occupies 0.1 to 60 parts by mass with respect to 1 part by mass of conductive polymer fine particles.
MORI HIROO
KAWABATA TSUNEICHI
| JP2010018842A | 2010-01-28 | |||
| JP2008208389A | 2008-09-11 | |||
| JP2009041090A | 2009-02-26 |
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