PLATED PRODUCT AND PLATING METHOD

Title:

PLATED PRODUCT AND PLATING METHOD

Document Type and Number:

Japanese Patent JP2013019024

Kind Code:

A

Abstract:

To provide a plated product with a plating film allowing less degradation in strength due to hydrogen embrittlement formed on a metal substrate, and a method of manufacturing the same.

At least a lower layer plating film and an upper layer plating film are formed on the metal substrate with a Vickers hardness between 200 and 800. The lower layer plating film is made of nickel or nickel alloy containing 50 mass% or more nickel with a thickness of 3-10 μm, and the upper layer plating film is made of zinc, zinc alloy containing 50 mass% or more zinc, chromium, chromium alloy containing 50 mass% or more chromium, iron, iron alloy containing 50 mass% or more iron, copper, copper alloy containing 50 mass% or more copper, tin, tin alloy containing 50 mass% or more tin, gold, gold alloy containing 50 mass% or more gold, silver, rhodium, palladium, or platinum with a thickness of 1-100 μm.

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Inventors:

SONODA TSUKASA
YAMAGUCHI ATSUSHI
YAMAGUCHI TAKEHIKO
OGAWA KENJI

Application Number:

JP2011153073A

Publication Date:

January 31, 2013

Filing Date:

July 11, 2011

Export Citation:

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Assignee:

HYOGO PREFECTURE
DAISHO KK

International Classes:

C25D5/12; C23C28/00; C25D7/00

Domestic Patent References:

JP2000202796A	2000-07-25
JPH0364595A	1991-03-19
JPH0754194A	1995-02-28
JPS60110892A	1985-06-17

Foreign References:

US7514153B1	2009-04-07
US5810992A	1998-09-22

Attorney, Agent or Firm:

Patent business corporation Yuko patent office

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