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Patent Searching and Data


Title:
PLATED RESIN MOLDING AND PRODUCTION METHOD THEREOF
Document Type and Number:
Japanese Patent JP2019121582
Kind Code:
A
Abstract:
To provide a partially plated molding that can be mass-produced, and to provide a molding method thereof.SOLUTION: A resin molding having a surface plated at least partially, and a production method thereof are provided. The molding has an open hole communicating from the reverse face to the partially plated part on the front face. The production method includes a step of introducing resin into a mold and obtaining a molding, a step of performing electroless plating and forming a passage way of electric current connecting from the reverse face of the molding to the front face through the open hole, and a step of performing electric plating. The open hole has a surface side part of thick width and a reverse face side part of thick width, and a connection part of thin width connecting the surface side part and the reverse face side. The width of the connection part is large enough to form the passage way of electric current, but smaller than the width causing harmful effect on the exterior appearance of the molding.SELECTED DRAWING: Figure 1

Inventors:
有光 康
Application Number:
JP2018002768A
Publication Date:
July 22, 2019
Filing Date:
January 11, 2018
Export Citation:
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Assignee:
株式会社太洋工作所
International Classes:
H01H11/00; H01H13/14
Attorney, Agent or Firm:
山本 秀策
森下 夏樹