Title:
PLATED SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2008088515
Kind Code:
A
Abstract:
To provide a plated substrate having a metallic layer of a fine pattern formed thereon with high accuracy, and to provide a manufacturing method therefor.
The method for manufacturing the plated substrate 100 is a manufacturing method for forming the metallic layer with an electroless plating method, and comprises the steps of: forming a resin-molded body 22 with an arbitrary pattern containing a catalytic metal 31 which functions as a catalyst for electroless plating, on a substrate; and immersing the substrate into an electroless plating solution to precipitate a metal on the resin-molded body to form the metallic layer.
Inventors:
KANEDA TOSHIHIKO
KIMURA SATOSHI
FURUHATA HIDEMICHI
KIJIMA TAKESHI
KIMURA SATOSHI
FURUHATA HIDEMICHI
KIJIMA TAKESHI
Application Number:
JP2006271806A
Publication Date:
April 17, 2008
Filing Date:
October 03, 2006
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
C23C18/31; H05K3/18
Attorney, Agent or Firm:
Yukio Fuse
Mitsue Obuchi
Tatsuya Ina
Mitsue Obuchi
Tatsuya Ina