To provide a termination feature for a multilayer electronic component.
The plated termination in question is guided and fixed by an exposed internal electrode tab that can be selectively extended on a cover layer of the multilayer component and an anchor tab. Such an anchor tab is arranged inside or outside a chip structure and forms a core of a plating material on which additional metallization has been performed. External anchor tabs arranged on both the top surface and the bottom surface of a monolithic structure make it easy to form a selective wrap-around plated termination. The technique includes an interdigitated capacitor, a multilayer capacitor array, and an integrated passive component and can be used in a plurality of monolithic multilayer components. Various different plating techniques and termination materials can be used for forming a self-determined plated termination in question.
HEISTAND ROBERT II
GALVAGNI JOHN L
DATTAGURU SRIRAM
HORN JEFFREY A
JPH09129476A | 1997-05-16 | |||
JPH01293503A | 1989-11-27 | |||
JPH02294007A | 1990-12-05 | |||
JP2001155953A | 2001-06-08 | |||
JP2001167969A | 2001-06-22 |
Kazuo Abe
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