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Patent Searching and Data


Title:
PLATED TERMINATION
Document Type and Number:
Japanese Patent JP2004312023
Kind Code:
A
Abstract:

To provide a termination feature for a multilayer electronic component.

The plated termination in question is guided and fixed by an exposed internal electrode tab that can be selectively extended on a cover layer of the multilayer component and an anchor tab. Such an anchor tab is arranged inside or outside a chip structure and forms a core of a plating material on which additional metallization has been performed. External anchor tabs arranged on both the top surface and the bottom surface of a monolithic structure make it easy to form a selective wrap-around plated termination. The technique includes an interdigitated capacitor, a multilayer capacitor array, and an integrated passive component and can be used in a plurality of monolithic multilayer components. Various different plating techniques and termination materials can be used for forming a self-determined plated termination in question.


Inventors:
RITTER ANDREW P
HEISTAND ROBERT II
GALVAGNI JOHN L
DATTAGURU SRIRAM
HORN JEFFREY A
Application Number:
JP2004113445A
Publication Date:
November 04, 2004
Filing Date:
April 07, 2004
Export Citation:
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Assignee:
AVX CORP
International Classes:
B05D5/12; C23C18/16; H01C1/142; H01F5/00; H01G4/252; H01F27/29; H01G2/06; H01G4/12; H01G4/228; H01G4/232; H01G4/30; H01G4/38; H01G7/00; H01L21/60; H01L23/50; H05K1/09; H05K1/11; H05K3/40; (IPC1-7): H01G4/12; H01G4/30; H01G4/38
Domestic Patent References:
JPH09129476A1997-05-16
JPH01293503A1989-11-27
JPH02294007A1990-12-05
JP2001155953A2001-06-08
JP2001167969A2001-06-22
Attorney, Agent or Firm:
Yoshikazu Tani
Kazuo Abe