To provide a multilayer electronic component for a plated termination for a multilayer electronic component, for example, for a capacitor, for a resistor, for an inductor, or for an integrated passive element.
In a plated termination, a plurality of internal electrodes and a plurality of internal anchor tabs are interleaved with a plurality of dielectric layers, and exposed to a side of a device in one or more aligned arrays. Each exposed part in a specified array is located on the aligned array selected by a bridged termination in mutually predetermined distance, so as to form one or more solder termination materials by depositing. The internal anchor tab is exposed so as to be related with other conductor units as previously designed, and the nucleus forming of a metallization solder plating material in the side of the device can be assisted. By an external anchor tab, the termination extending in the top surface and/or bottom of the device is formed so as to be thicker than the internal conductive element, and/or embedded in the top surface and/or the bottom surface.
HEISTAND ROBERT II
GALVAGNI JOHN L
DATTAGURU SRIRAM
HORN JEFFREY A
LADEW RICHARD A
| JPH09129476A | 1997-05-16 | |||
| JPH01293503A | 1989-11-27 | |||
| JPH02294007A | 1990-12-05 | |||
| JP2001155953A | 2001-06-08 | |||
| JP2001167969A | 2001-06-22 |
Kazuo Abe