Title:
PLATING APPARATUS FOR PLATING COPPER-TIN ALLOY
Document Type and Number:
Japanese Patent JPS5882000
Kind Code:
A
Abstract:
PURPOSE:To enable the control of Ni concn. always, by mounting a mechanism for measuring absorbancy of a plating bath. CONSTITUTION:A liquid recirculating pipe 3 is provided to the plating tank 1 of a plating apparatus for plating a Cu-Sn alloy and a plating bath is recirculated through a pump 2. A bypass passage 4 is provided to said liquid recirculating pipe 3 and an apparatus for measuring absorbancy of the plating bath on the way thereof. In the apparatus 5, a light source 6 is formed to one side of an absorbancy measuring cell 8 connected to the bypass passage 4 and a light receiving part 7 to the other side thereof. Therefore, the variation of Ni concn. in the plating bath can be always measured and the control of Ni concn. is facilitated.
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Inventors:
OGAWA KENICHI
IKENO HIROSHIGE
IKENO HIROSHIGE
Application Number:
JP17810881A
Publication Date:
May 17, 1983
Filing Date:
November 06, 1981
Export Citation:
Assignee:
SEIKO INSTR & ELECTRONICS
International Classes:
C25D21/14; (IPC1-7): C25D21/14
Attorney, Agent or Firm:
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