Title:
PLATING APPARATUS AND PLATING METHOD
Document Type and Number:
Japanese Patent JP2023180832
Kind Code:
A
Abstract:
To provide a plating apparatus and a plating method capable of maintaining proper posture even with respect to a large substrate and obtaining a uniform film.SOLUTION: A plating apparatus of the present invention for plating at least one main surface of a rectangular substrate comprises a treatment tank for storing a plating solution, an anode electrode brought into contact with the plating solution in the treatment tank, and a substrate holding part for holding the substrate in a horizontal posture with one main surface facing upward in the treatment tank. The substrate holding part has a plurality of chuck mechanisms which has a cathode electrode and holds the substrate while the cathode electrode is brought into contact with the one main surface. At least one chuck mechanism is arranged for each of at least two opposite sides of the substrate.SELECTED DRAWING: Figure 2
Inventors:
KINUNO ATSUSHI
NISHIKIUCHI YOSHIFUMI
NISHIKIUCHI YOSHIFUMI
Application Number:
JP2022094449A
Publication Date:
December 21, 2023
Filing Date:
June 10, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
C25D17/06; C25D7/00; C25D17/00; C25D17/08; C25D21/10; C25D21/12
Attorney, Agent or Firm:
Shoichi Swing
Kazumasa Ohnishi
Kazumasa Ohnishi
Previous Patent: display device
Next Patent: Transfer control device, transfer control method, transfer control program
Next Patent: Transfer control device, transfer control method, transfer control program