To provide a plating apparatus capable of uniformly plating a work such as a wafer.

In the plating apparatus comprising a plating tank 32, a holding jig 34 capable of electrically connecting a work 35 to be plated to a cathode, fitting the work 35 in an attachable/detachable manner and immersing the work in an electrolyte in the plating tank, an anode plate 37 disposed in the electrolyte facing a plating surface of the work, and a nozzle 40 for spraying the electrolyte from a nozzle part on the plating surface of the work with the tip nozzle part disposed between the work and an anode plate, a rotary blade 44 which is rotated in a plane substantially orthogonal to the spraying direction of the electrolyte sprayed from the nozzle part to guide the electrolyte sprayed from the nozzle part to a circumferential edge part side of the plating surface of the work is provided between the work fitted to the holding jig 34 and the nozzle part.