To provide a plating apparatus which forms a plating layer having a uniform thickness on each base material particle having an electroconductive surface in a high yield.

The plating apparatus includes: a plating tank 1j having a plating chamber which is equipped with a bottom surface on which base material particles revolve while being brought into contact with the bottom surface and a peripheral wall surface erected along the peripheral edge of the bottom surface, and accommodates a particle group 9 including the base material particles and a plating solution; a plating solution supply pipe 1e which has a supply port 1f opening at an upper part of the bottom surface of the plating chamber and supplies the plating solution from the supply port so that the plating solution may revolve along the peripheral wall surface of the plating chamber; a plating solution discharge pipe 1c having a discharge port 1d opening in the plating chamber; a cathode 1n which is brought into contact with base material particles being arranged on the bottom surface of the plating chamber 1m; an anode 1o arranged at a position immersed in the plating solution accommodated in the plating chamber; and a power source 1h connected to the cathode and the anode. The discharge port 1d of the plating solution discharge pipe is closed with a plating solution permeable member 4 through which the plating solution permeates but the base material particles do not permeate.