To provide a plating apparatus that can increase a depositing rate of plating on a wire surface.

The plating apparatus for applying plating on the surface of a wire 4 running through a plating solution 3, includes: a plating solution bath 5 for storing the plating solution 3; a columnar body 6 longitudinally disposed in the plating solution bath 5; and a flow mechanism 9 for causing the plating solution 3 to flow through a ring-like flow path X, which is formed between an inner peripheral surface 51 of the plating solution bath 5 and an outer peripheral surface 61 of the columnar body 6, with respect to the wire 4 running longitudinally through the ring-like flow path X.