Title:
PLATING AREA MEASURING DEVICE OF PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH01321308
Kind Code:
A
Abstract:
PURPOSE:To calculated the plating area with good accuracy by employing pattern data, NC drill data and board thickness data of a printed circuit board. CONSTITUTION:Almost all the data on a printed circuit board has been inputted in advance in a computer system 1 so as to output a pattern forming film and NC data. The plating area is calculated with using this pattern data of the system 1. Then, the pattern data is changed to raster data to calculate a pattern area Sp. Thereafter, the area of a hole is calculated by using punching NC drill data and board thickness data in the system 1. In the first plate, a punch area S1 to be cut out by a drill is obtained from data of the drill diame ter. Then, the area S3 of a non-through hole is obtained. Further, the area S2 inside a through hole is obtained. The area Sh of the hole is represented by an equation; Sh=S2-2S1-2S3. Thus, the total plating area S is obtained by an equation; S=Sp+Sh.
Inventors:
MORI MIKIO
Application Number:
JP15783588A
Publication Date:
December 27, 1989
Filing Date:
June 24, 1988
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
G01B21/28; H05K3/42; H05K3/24; (IPC1-7): G01B21/28
Attorney, Agent or Firm:
Hironori Takenori
Previous Patent: JP1321307
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