Title:
PLATING DEPOSITION CONTROLLER FOR HOT DIP METAL COATING LINE OF METALLIC WIRE
Document Type and Number:
Japanese Patent JP3182473
Kind Code:
B2
Abstract:
PURPOSE: To minimize the fluctuation in plating deposition in operation to be carried out over a long period of time by executing feed back control of the plating deposition during a plating stage.
CONSTITUTION: The wire diameter D1 of the unplated wire delivered from a delivery section and the wire diameter D2 of the plated wire taken up on a take-up section are measured. The plating deposition N is calculated from the wire diameter data obtd. in such a manner. Whether the plating deposition N is within a permissible range of the preset objective deposition or not is decided. The traveling speed of the wire is controlled to vary in a direction where the plating deposition N is kept within the permissible range when the plating deposition is decided to be deviated from this range.
Inventors:
Hiroaki Nakamura
Jun Takeuchi
Jun Takeuchi
Application Number:
JP14903293A
Publication Date:
July 03, 2001
Filing Date:
June 21, 1993
Export Citation:
Assignee:
Tokyo Rope Co., Ltd.
International Classes:
C23C2/14; C23C2/38; G01B11/10; (IPC1-7): C23C2/14
Domestic Patent References:
| JP394051A | ||||
| JP5203593A | ||||
| JP5306453A |
Attorney, Agent or Firm:
Takehiko Suzue