Title:
PLATING DEVICE ADJUSTMENT METHOD AND MEASURING DEVICE
Document Type and Number:
Japanese Patent JP2017008347
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a measuring device and a method for optimally adjusting the positions of a substrate holder, an anode holder, a regulation plate, and/or a paddle without practically plating and measuring the film thickness distribution.SOLUTION: The adjustment method of a plating device 100 including a substrate holder 103, an anode holder 105, and an electric-field adjusting plate 106 includes: disposing a first jig at a position where the substrate holder 103 is disposed; disposing a second jig at a position where the anode holder 105 or the electric-field adjusting plate 106 of a plating tank 101 is disposed; measuring a positional relation between the first jig and the second jig disposed in the plating tank 101 by using a sensor provided to either the first jig or the second jig; and adjusting the disposing positions of the substrate holder 103, the anode holder 105 or the electric-field adjusting plate 106 based on the measured positional relation.SELECTED DRAWING: Figure 1
Inventors:
FUJIKATA JUNPEI
SHIMOYAMA TADASHI
ARAKI YUJI
NAGAI MIZUKI
SHIMOYAMA TADASHI
ARAKI YUJI
NAGAI MIZUKI
Application Number:
JP2015122876A
Publication Date:
January 12, 2017
Filing Date:
June 18, 2015
Export Citation:
Assignee:
EBARA CORP
International Classes:
C25D21/00; C25D17/00; C25D17/06; C25D17/08; G01B21/00
Domestic Patent References:
| JP2013064202A | 2013-04-11 | |||
| JP2004346345A | 2004-12-09 | |||
| JP2013064202A | 2013-04-11 | |||
| JP2004346345A | 2004-12-09 |
Foreign References:
| US20090139871A1 | 2009-06-04 | |||
| US20090139871A1 | 2009-06-04 |
Attorney, Agent or Firm:
Shinjiro Ono
Toru Miyamae
Yukio Kanegae
Koichi Kushida
Makoto Watanabe
Toru Miyamae
Yukio Kanegae
Koichi Kushida
Makoto Watanabe
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