PURPOSE: To provide a plating device capable of preventing the adhesion of works to each other and forming plating films of a uniform film thickness on the surfaces of the works.
CONSTITUTION: This plating device 30 is constituted by connecting first and second air cylinders 32, 33 to one end of a connecting member 21 connected to a cathode 18. This first air cylinder 32 moves the connecting member 21 and the cathode 18 horizontally at relatively large amplitude to invert the posture of the works. In succession, the second cylinder 33 is driven to finely vibrate the cathode 18 and to drop the stacked works onto the cathode 18, by which the conduction with the cathode 18 is assured. The first and second air cylinders 32, 33 are thereafter held still for a specified period of time. The plating films are formed by applying the similar vibration mode repetitively on the cathode 18.
| JPS5842277 | [Title of the Invention] Accessories plating device |
| JPS56169798 | PLATING APPARATUS |
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HAMADA KUNIHIKO
NOJIRI SHIGEHIRO
YONEDA YASUNOBU
