Title:
めっき装置及びめっき方法
Document Type and Number:
Japanese Patent JP7235012
Kind Code:
B2
Abstract:
To provide a plating apparatus and a plating method capable of suppressing damage to a plating object.SOLUTION: A plating apparatus comprises: a plating bath 10 for storing a plating solution 15; a first electrode 20 having a mounting surface 21 on which a plating object 5 can be mounted and in which at least the mounting surface 21 is arranged inside the plating bath 10; a second electrode 30 having a facing surface 31 facing the mounting surface 21 and arranged inside the plating bath 10 in a state where the facing surface 31 faces the mounting surface 21; a power supply part 40 connected to the first electrode 20 and the second electrode 30, the power supply part 40 generating potentials at the first electrode 20 and the second electrode 30 so that the first electrode 20 serves as a cathode and the second electrode 30 serves as an anode; and a sliding part 50 slidably arranged on the mounting surface 21 and capable of sliding the plating object 5 mounted on the mounting surface 21 with respect to the mounting surface 21.SELECTED DRAWING: Figure 1
Inventors:
Hirotoshi Watanabe
Kenichi Hayashi
Kenichi Hayashi
Application Number:
JP2020105272A
Publication Date:
March 08, 2023
Filing Date:
June 18, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
C25D17/28; C25D17/00; C25D17/22; C25D21/00
Domestic Patent References:
| JP8283995A | ||||
| JP50047914U | ||||
| JP49113731A |
Attorney, Agent or Firm:
Ryuta Kato
Tetsuo Shiba
Tetsuo Shiba