Title:
PLATING EQUIPMENT
Document Type and Number:
Japanese Patent JP3877911
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide plating equipment, which can stably perform high-quality plating by preventing bubbles from adhering to the plated surface of a substrate and stabilizing a black film formed on the surface of its anode.
SOLUTION: Plating equipment is constituted, in such a way that a plating solution chamber 11 is positioned above a substrate 16 to be plated which is set up with its surface to be plated upward, in a state where the chamber 11 is faced oppositely to the substrate 16, and an anode plate 14 is set in the chamber 11 in a state where the plate 14 faces opposite the surface to be plated of the substrate 16. Then a porous body 12 having many narrow pores is set up on the lower surface of the plating solution chamber 11, so that a plating solution Q1 supplied to the chamber 11 is supplied to the surface to be plated of the substrate 16 through the porous body 12.
Inventors:
Kenichi Sasabe
Akihisa Hongo
Junji Kunizawa
Akihisa Hongo
Junji Kunizawa
Application Number:
JP19492299A
Publication Date:
February 07, 2007
Filing Date:
July 08, 1999
Export Citation:
Assignee:
Ebara Corporation
International Classes:
H05K3/18; C25D7/12; (IPC1-7): H05K3/18; C25D7/12
Domestic Patent References:
| JP10226896A | ||||
| JP6280098A | ||||
| JP10298795A | ||||
| JP1294888A |
Attorney, Agent or Firm:
Takashi Kumagai
Yu Takagi
Yu Takagi
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